Laser PCB Depaneling Machine

Laser PCB Depaneling Machine

Laser depaneling uses the focused high power density laser beam irradiate workpiece, under the laser power density exceeding the laser threshold, the energy of the laser beam and the chemical reaction heat energy of the reactive gas-assisted cutting process are all absorbed by the material, thereby causing the temperature of the laser point of sharp increase in the boiling point of the material began to gasification and the formation of holes, with the relative movement of the beam and the workpiece, and ultimately the material to form a slit, slit at a certain auxiliary gas blowing....

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Product  Features:

Adopted with high-performance UV laser cold light source, high-precision CCD image positioning technology and self-developed visual laser control software, the FPC flexible PCB laser cutting machine of HGLASER perfectly implements contour cutting, drilling of FPC and PCB, and precision processing of composite membrane.

● Without models, one-step forming, save a lot of costs;

● Precision two-dimensional worktable and full closed-loop CNC system ensure the high precision of micron dimension;

● Position sensor and CCD image positioning technology;

● Automatic positioning and focusing system produce high efficiency.


Tech Parameter:


Laser Source

355 nm UV


10 W

Coaxial Video Positioning


Scan Range

60×60 mm

Focused Spot Diameter

<20 um (UV Laser)

Auto Focus System

Z axis auto focus

Focus Control Precision

0.01 mm

Main structure configuration

X-Y Working Platform

Ac servo motor


High-precision granite platform

Travel Range

300×400 (Optional size range)

Platform Motion Resolution

0.5 um

Overall Control System


Assisted Control System

Mitsubishi PLC

CCD Lighting Source

620 nm red light LED

External Auxiliary Device

Negative pressure air blower, dusting system







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