High-Speed Connector Laser Annealing System
HGTECH High-Speed Connector Laser Annealing System utilizes high-energy-density diode and fiber lasers with a non-contact laser scanning heating process, enabling microsecond-scale rapid heating and controlled cooling on electroplated metal surfaces. This process induces grain recrystallization and stress relief, significantly improving the hardness, wear resistance, and conductivity of contact points while eliminating substrate deformation and plating damage caused by conventional furnace annealing.
| Item | Main Technical Parameters |
|---|---|
| System Model | LWG1000Z |
| Laser Wavelength | 915nm |
| Motion System | Motion: X/Y/Z travel 300 × 300 × 200 mm |
| Cooling System | Air cooling |
| System Dimensions | 760mmx820mmx2000mm |
| System Weight | 300kg |
| Power Supply | 220v 50Hz |
| Power Consumption | 3000W |
Key Features
No Thermal Damage
Laser energy can be precisely focused on micron-scale pin surfaces to achieve selective regional annealing, causing no thermal damage to surrounding plastic substrates and completely preventing connector deformation and performance degradation caused by bulk heating.
Performance Optimization
The rapid annealing process optimizes the microstructure of terminal surfaces, significantly enhancing surface hardness and wear resistance. Connector mating cycle life is increased by 3–5 times, while contact resistance is reduced by more than 15%, fully meeting the stringent performance and reliability requirements of 5G communications, high-speed computing, and automotive electronics.
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