
UV Laser Cutting Machine
Product Features:
Equipment has launched more than 6 years, stable and reliable performance have been proved by global markets, machine precision ± 20um, can meet customer CPK requirements, praised by multiple customers;
The 1st company who entered in O-film system, applied in fingerprint modular cutting, has accumulated mature experience, widely studied and imitated by other competitors;
With mature experience of high-end customers, typical customers: Inventec Appliances Corporation(Apple), Jabil(Apple), PEGATRON(Apple), O-film, HOLITECH, BYD, YDET, Flextronics, etc;
Equip strong independent research and development ability, has already launched auto loading/unloading, inline models, also available to offer customized machine to support your production;
Machine varies from 12W to 20W, satisfy different requirements;
Tech Parameter:
Laser | Laser Source | 355 nm UV |
Power | 10 W | |
Coaxial Video Positioning | B/W CCD | |
Scan Range | 60×60 mm | |
Focused Spot Diameter | <20 um (UV Laser) | |
Auto Focus System | Z axis auto focus | |
Focus Control Precision | 0.01 mm | |
Main structure configuration | X-Y Working Platform | Ac servo motor |
Base | High-precision granite platform | |
Travel Range | 300×400 (Optional size range) | |
Platform Motion Resolution | 0.5 um | |
Overall Control System | IPC | |
Assisted Control System | Mitsubishi PLC | |
CCD Lighting Source | 620 nm red light LED | |
External Auxiliary Device | Negative pressure air blower, dusting system | |
Environmental Conditions | Power Supply | AC 220V±10%,50HZ,1P,3KVA |
Fixture | Customize to the needs | |
Document Format | DXF, GBR, etc. | |
Environment Temperature | 15-30°(constant temperature for high precision) | |
Environment Humidity | <50% | |
Weight | 1500KG | |
Mainframe Size | 1350mm(W) ×1050mm(D) ×1950(H) |
Applicatons:
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