PCB Laser Engraving Marking Machine

PCB Laser Engraving Marking Machine

Type: PCB Laser marking machine Marking Method: Scanning Marking Function: Marking, Engraving Material Example 1: Monocrystalline Silicon Chip, IC Grain, Sapphire Material Example 2: Glass, TFT, LCD, Textile, Ceramic, and So on Marking Area: 100*100/200*200mm Laser depaneling uses the focused......

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Type: PCB Laser marking machine

Marking Method: Scanning Marking

Function: Marking, Engraving

Material Example 1: Monocrystalline Silicon Chip, IC Grain, Sapphire

Material Example 2: Glass, TFT, LCD, Textile, Ceramic, and So on

Marking Area: 100*100/200*200mm


Laser depaneling uses the focused high power density laser beam irradiate workpiece, under the laser power density exceeding the laser threshold, the energy of the laser beam and the chemical reaction heat energy of the reactive gas-assisted cutting process are all absorbed by the material, thereby causing the temperature of the laser point of sharp increase in the boiling point of the material began to gasification and the formation of holes, with the relative movement of the beam and the workpiece, and ultimately the material to form a slit, slit at a certain auxiliary gas blowing. 


Laser depaneling provides simple, fast, non-consumable, non-contact, non-mechanical, high-precision arbitrary shape of the crossed, half-cutting, cutting solutions to meet stringent manufacturing requirements for production and processing technology of the rapid changes.


Features

●Create a new processing mode, without a mold can be cut by CAD drawings any shape products, shorten the production cycle, the liberation of human resources;

●High accuracy, low drift galvanometer combined with a servo system platform delivers superior micrometer cutting accuracy;

●Stress-free cutting mode and fully automatic CCD positioning system combine to bring the perfect cutting effect;

● High cutting speed, small heat affected zone. Heat affected layer depth 0.05 - 0. 1mm, small thermal distortion;

● Perfect cutting quality. Incision edge smooth, no collapse, no cutting residue. The profile of complex and small radius of curvature and other contours can achieve micron-precision cutting. Slit narrow,generally 0.1 to 1 mm;

●Green cutting process to avoid the harm to the operator and the environment pollution;

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