UV Laser PCB Cutting Machine
Product Features:
High rigidity design with damping pads and natural granite machine base, eliminating the table move inertial vibration during processing.
"Cold Laser Processing": To use of short wavelength ultraviolet laser beam scans the surface of the flexible circuit board, so this "cold" light eclipse machined parts small heat-affected zone, with smooth edges and minimal charring, ensure the PCB/FPC manufacture yield ratio.
Self-patented control software has independent intellectual property rights of humanity, useful functions, simple operation, CAM software compatible with direct conversion by dxf or gbr files from CAD software in ease editing.
Comprehensive unified development platform, the expansion of arbitrary functions with high-quality, high- speed cutting function rigid material, thickness up to 1mm (0.04 "). Almost no glitches after processing in the processed PCB/FPC, there is no thermal effect generated layer in high cutting accuracy .
Tech Parameter:
Laser | Laser Source | 355 nm UV |
Power | 10 W | |
Coaxial Video Positioning | B/W CCD | |
Scan Range | 60×60 mm | |
Focused Spot Diameter | <20 um (UV Laser) | |
Auto Focus System | Z axis auto focus | |
Focus Control Precision | 0.01 mm | |
Environmental Conditions | Power Supply | AC 220V±10%,50HZ,1P,3KVA |
Fixture | Customize to the needs | |
Document Format | DXF, GBR, etc. | |
Environment Temperature | 15-30°(constant temperature for high precision) | |
Environment Humidity | <50% | |
Weight | 1500KG | |
Mainframe Size | 1350mm(W) ×1050mm(D) ×1950(H) |
Applicatons:
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