Oct 27, 2020 Leave a message

Flexible PCB FPC Laser Depaneling Machinery

Product Description

Flexible PCB  FPC Laser Depaneling Machinery 

USAGE

The machine is used in cutting,opening the window and uncovery for CVL/FPC/RF and thin multilayer board, as well as cutting a variety of substrates, such as ceramic, silicon etc.

ADVANTAGE 
 
Two tables to cycle working one by one,no preparing time,high processing efficiency.
 
Preview function before processing to avoid damaging sample.

Bar code marking function.


TECHNICAL PARAMETER

Specification of UV Laser Cutting Machine
ModelJG16C
Wavelength355nm
Laser PowerStandard 10W,Option 15W
Laser Frequency30-120kHz
Maximum Processing Size650mm x 550mm
(Double platforms)
Maximum Operating Speed800mm/s
Positioning Accuracy of Table±3μm
Repetitive Positioning Accuracy of Table±1μm
Total Accuracy±20um
light spots20±5μm
Scanning range45mmx45mm
File Format*.gbr & *.dxf & *.lay
Electric Power SupplyAC220V/2kW; AC380V/5.5kW
Dimensions(L x W x H)1780mmx1610mmx1650mm
Weight3600kg
Environmental Temperature20±2ºC
Environmental Humidity≤60%RH, Non-condensing
Ground Amplitude≤5μm
Ground Pressure≥1000Kgf/m2

 

About Us


Wuhan Huagong Laser Engineering Co.,Ltd possesses HGLASER and FARLEY?LASERLAB two famous brands. HGLASER has always been committed to providing broad and comprehensive laser manufacturing solutions in industrial manufacturing field, researching, manufacturing and selling various laser processing and plasma machining equipments, providing tube laser cutting processing and oil pipeline trade services. The main products of HGLASER cover the full power series of laser cutting systems, laser welding systems, laser marking series, laser texturing equipments, laser heat treatment systems, laser drilling machines, laser devices, all kinds of support devices, laser processing and plasma machining equipments, which are used widely in metallurgy, non-ferrous metals, automobiles, parts, aviation, military, precision instruments, machine manufacturing, hardware, integrated circuits, semiconductor manufacturing, solar, education, communication and measurement, packaging, leathers, plastics, rubbers, jewelries, crafts, medical equipments, etc.


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